• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
      METHOD AND APPLIANCE FOR DRYING ELECTRONIC DEVICE, DEVICE AND METHOD FOR REMOVING MOISTURE FROM AN ELECTRONIC DEVICE, AND, METHOD FOR MANUFACTURING A DEVICEMethods and apparatus for electronic drying devices are described. Embodiments include methods and devices that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat. Other embodiments include a desiccator to remove moisture from the air being evacuated from the electronic device before the air reaches an evacuation pump. Other embodiments detect moisture inside the low pressure chamber and determine when to increase and / or decrease pressure based on moisture. Still other embodiments determine that the device is sufficiently dry to restore proper function based on the detected humidity, and in some embodiments based on changes in humidity, while the pressure is being increased and / or decreased. Still other alternative embodiments automatically control some or all aspects of drying the electronic device. Additional embodiments disinfect the electronic device.
    公开号:BR112014018989A2
    申请号:R112014018989-7
    申请日:2013-02-01
    公开日:2020-10-27
    发明作者:Reuben Quincey Zielinski；Joel Christopher Trusty
    申请人:Revive Electronics, LLC；
    IPC主号:
    专利说明:

    [0001] [0001] This order claims priority for US Provisional Orders Nos. 61 / 593,617, deposited on February 1, 2012, and 61 / 638,599, deposited on April 26, 2012, the totalities of which are incorporated herein for reference. FIELD
    [0002] [0002] Modalities of the present exhibition generally refer to the repair and maintenance of electronic devices, and to the repair and maintenance of electronic devices that have been made at least partially inoperative due to the penetration of wetting. FUNDAMENTALS
    [0003] [0003] Electronic devices are often manufactured using ultra-precision parts for narrow fitting and finishing dimensions, which are intended to prevent moisture from entering the interior of the device. Many electronic devices are also manufactured to make disassembly by owners and / or users difficult, without rendering the device inoperative, even before drying attempts. With the continued miniaturization of electronic components and increasingly powerful computerized software applications, it is commonplace for people today to have multiple electronic devices, such as portable electronic devices. Cell phones are now more ubiquitous than landline phones, and many people, on a daily basis across the world, inadvertently subject these devices to contact with water or other fluids. This occurs daily in, for example, bathrooms, kitchens, pools, lakes, washing machines, or any other areas in which various electronic devices (for example, small portable electronic devices) can be submerged in water or subject to high humidity conditions. . These electronic devices often have miniaturized solid state transistorized memory to capture and store digitized media in the form of telephone contact lists, e-mail addresses, digitized photographs, digitized music, and the like. SUMMARY
    [0004] [0004] In conventional technique, difficulties currently exist in removing moisture from the inside of an electronic device. Such devices can be heated without any success, as wetting inside the device often cannot escape due to tortuous removal paths. Without the complete disassembly of the electronic device and without using a combination of heat and air drying, the device cannot be properly dried, since it is subjected to water and / or other humidifying agents or fluids. In addition, if general heating is employed to dry the device and the heat exceeds the recommended maximum for electronic components or other components, damage may occur; the device may become inoperable, and data scanned by the owner may be lost forever. It has been realized that a new type of drying system is needed to allow individuals and repair shops to dry electronic devices without disassembly, while retaining digitized data and / or while protecting the electronic device completely from corrosion.
    [0005] [0005] Modalities of the present invention refer to equipment and methods for vacuum-pressure drying of materials based on lowering the vapor pressure and the boiling points of liquids. More particularly, certain embodiments of the invention relate to a vacuum chamber with a heated plate that can be automatically controlled to heat electronic components, such as an inoperable portable electronic device, through conduction, thereby reducing the overall vapor pressure temperature to drying purposes of the device and making it operable again.
    [0006] [0006] In certain embodiments, a plate that is electrically heated provides heat conduction for the portable electronic device that has been subjected to water or other unwanted humidification agent (s). This heated plate can form the basis of a vacuum chamber, from which air is selectively evacuated. The heated conductive plate can raise the total temperature of the wet device through physical contact and the material's heat transfer coefficient. The heated conductive plate, being housed in a convective box, radiates heat and can heat other portions of the vacuum chamber (for example, the exterior of the vacuum chamber) for simultaneous heating by convection. The pressure inside the vacuum chamber housing that contains the electronic wet device can be simultaneously reduced. The reduced pressure provides an environment by which liquid vapor pressures can be reduced, allowing for lower boiling points of any liquid or humidifying agent within the chamber. The combination of a heated path (for example, a heated conductive path) to the wet electronic device and reduced pressure, results in a vapor pressure phase, in which the humidifying agents and liquids are “boiled out” in the form of a gas at lower temperatures, thus preventing damage to electronic components during drying. This drying occurs because the vaporization of liquids to form gases can more easily escape through the narrow spaces of the electronic device and through the tortuous paths established in the design and manufacture of the device. The water or humidifying agent is essentially extracted by boiling over time as a gas and then evacuated from inside the chamber housing.
    [0007] [0007] Other modalities include a vacuum chamber with a heated plate under automatic control. The vacuum chamber is controlled by the microprocessor using various heat and vacuum profiles for various electronic devices. This heated vacuum system, for example, provides a local condition for the electronic device that has been humidified and reduces the global vapor pressure point, allowing the humidifying agents to boil at a much lower temperature. This allows for the complete drying of the electronic device without damage to the device itself with respect to excessive (high) temperatures.
    [0008] [0008] Certain features of the present invention address these and other needs and provide other important advantages.
    [0009] [0009] This summary is provided to introduce a selection of the concepts that are described in more detail in the detailed description and drawings contained here. This summary is not intended to identify any major or essential characteristics of the claimed matter. Some or all of the features described may be present in the corresponding independent claim or dependent claims, but should not be construed as a limitation, unless expressly mentioned in a particular claim. Each modality described here is not necessarily intended to address each objective described therein, and each modality does not necessarily include each characteristic described. Other forms, modalities, objectives, advantages, benefits, characteristics, and aspects of the present invention will become apparent to a person skilled in the art from the detailed description and drawings contained herein. In addition, the various apparatus and methods described in this summary section, as well as elsewhere in this application, can be expressed as a large number of different combinations and sub-combinations. As such, useful, new and inventive combinations and subcombination are contemplated here, and it is recognized that the explicit expression of each of these combinations is unnecessary. BRIEF DESCRIPTION OF THE DRAWINGS
    [00010] [00010] Some of the Figures shown here may include dimensions or may have been created from scale drawings. However, such dimensions, or the relative scale within the Figure, are by way of example only, and should not be construed as limiting the scope of this invention.
    [00011] [00011] Figure 1 is an isometric view of an electronic device drying apparatus according to one embodiment of the present exhibition.
    [00012] [00012] Figure 2 is an isometric bottom view of the electrically heated driving plate element of the electronic device drying apparatus shown in Figure 1.
    [00013] [00013] Figure 3 is a cut-out isometric view of the electrically heated driving plate element and vacuum chamber, shown in Figure 1.
    [00014] [00014] Figure 4A is an isometric view of the electrically heated driving plate element and vacuum chamber of Figure 1, in the open position.
    [00015] [00015] Figure 4B is an isometric view of the electrically heated driving plate element and vacuum chamber of Figure 1, in the closed position.
    [00016] [00016] Figure 5 is a block diagram representing an electronic components control system and an electronic device drying device, according to a modality of the present exhibition.
    [00017] [00017] Figure 6A is a graphical representation of a water vapor pressure curve at various vacuum pressures and temperatures and a drying zone targeted for heating and evacuation, according to one embodiment of the present exhibition.
    [00018] [00018] Figure 6B is a graphical representation of a water vapor pressure curve at a particular vacuum pressure representing heat loss as a result of the latent heat of evaporation.
    [00019] [00019] Figure 6C is a graphical representation of a water vapor pressure curve at a particular vacuum pressure representing heat gain as a result of heating the conduction plate.
    [00020] [00020] Figure 7 is a graphical representation of the temperature of the heated plate and the temperature of the associated electronic device, with no vacuum applied, according to a modality of the present exhibition.
    [00021] [00021] Figure 8A is a graph representing the temperature of the heated plate and temperature response of the associated electronic device, with vacuum cyclically applied and then ventilated to atmospheric pressure for a period of time, according to another modality of the present exhibition.
    [00022] [00022] Figure 8B is a graph representing vacuum cyclically applied and then ventilated to atmospheric pressure for a period of time, according to another modality of the present exhibition.
    [00023] [00023] Figure 8C is a graph representing a cyclically applied vacuum and then ventilated to atmospheric pressure, with the temperature response of the electronic device superimposed over a period of time, according to another modality of the present exhibition.
    [00024] [00024] Figure 9 is a graph representing the relative humidity sensor output that occurs during the successive heating and vacuum cycles of the electronic device drying apparatus, according to an embodiment of the present invention.
    [00025] [00025] Figure 10 is an isometric view of an electronic device drying device and germicidal element according to another embodiment of the present exhibition.
    [00026] [00026] Figure 11 is a block diagram representing a control system for electronic components, an electronic device drying device, and a germicidal element according to another modality of the present exhibition.
    [00027] [00027] Figure 12 is a block diagram of a regenerative desiccator, represented with 3-way solenoid valves in the open position, for example, to provide vacuum for an evacuation chamber, in the wetting-out state, according to another modality.
    [00028] [00028] Figure 13 is a block diagram of the regenerative desiccator of Figure 12 represented with 3-way solenoid valves in the closed position to, for example, provide an air purge for the desiccators. DESCRIPTION OF THE ILLUSTRATED MODALITIES
    [00029] [00029] For the purposes of promoting an understanding of the principles of the invention, reference will now be made to the selected modalities, illustrated in the drawings, and specific language will be used to describe them. However, it will be understood that no limitation on the scope of the invention is thus intended; any changes and other modifications to the modalities described or illustrated, and any other applications of the principles of the invention, when illustrated here, are contemplated, as would normally occur for a person skilled in the art to which the invention relates. At least one embodiment of the invention is shown in great detail, although it will be apparent to those skilled in the art that some features or combinations of features may not be shown for clarity.
    [00030] [00030] Any reference to "invention" within this document is a reference to a modality of a family of inventions, with no single modality including features that are necessarily included in all modalities, unless otherwise mentioned. In addition, while there may be references to "advantages" provided by some modalities of the present invention, other modalities may not include those same advantages, or may include different advantages. Any advantages described here are not to be construed as limiting any of the claims.
    [00031] [00031] Specific quantities (spatial dimensions, temperatures, pressures, times, strength, resistance, current, voltage, concentrations, wavelengths, frequencies, heat transfer coefficients, dimensionless parameters, etc.) can be used explicitly or implicitly here , such specific quantities are presented as examples only and are approximate values, unless otherwise indicated. Discussions pertaining to specific material compositions, if present, are presented as examples only and do not limit the applicability of other material compositions, especially other material compositions with similar properties, unless otherwise indicated.
    [00032] [00032] Modalities of the present exhibition include devices and equipment generally used for drying materials using reduced pressure. Modalities include methods and apparatus for drying (for example, automatic drying) electronic devices (for example, portable electronic devices, such as cell phones, digital music playback units, watches, pagers, cameras, computers such as “ tablet ”and the like) after these units have been subjected to water, high humidity conditions, or other harmful, unwanted humidifying agents that render such devices inoperative. At least one modality provides a heated plate (for example, a heated plate controlled by a user) under vacuum, which heats the portable electronic device and / or lowers the pressure to evaporate unwanted liquids at boiling points below atmospheric. Heat can also be applied by other means, such as heating other components of the vacuum chamber or gas (e.g., air) within the vacuum chamber. Heat and vacuum can be applied sequentially, simultaneously, or in various combinations of sequential and simultaneous operations.
    [00033] [00033] The evaporation point of the liquid present inside the device is lowered based on the building materials of the device being heated so that temperature excursions do not exceed the melting points and / or the transition temperatures to the glass of such materials. Thus, the device being subjected to the vacuum pressure drying cycle can be safely dried and made functional again without damage to the device itself.
    [00034] [00034] With reference first to Figure 1, an isometric diagram of a drying apparatus, for example, an automatic portable electronic drying apparatus 1, according to an embodiment of the present invention, is shown. The electronic device drying apparatus 1 includes a housing 2, the vacuum chamber 3, a heater (for example, the electrically heated conduction plate 16), an optional convection chamber 4, and an optional modem interface connector Internet 12. An optional user interface for the electronic device drying apparatus 1 may be used, and may optionally be comprised of one or more of the following: o input device selection switches 11, the selection indicator lamps of device 15, timer display 14, power switch 19, start-stop switch 13, and audible indicator 20. Vacuum chamber 3 can be made of, for example, a polymer plastic, glass, or metal, with appropriate thickness and geometry to withstand a vacuum (reduced pressure). The vacuum chamber 3 can be made of any material that is at least structurally rigid enough to withstand Vacuum pressures and to maintain vacuum pressures within the structure and, for example, is sufficiently non-porous.
    [00035] [00035] The heated conductor plate 16 can be electrically energized through heater energy wires 10 and can be manufactured from thermally conductive material and made of a suitable thickness to withstand high vacuum. In some embodiments, the electrically heated conduit plate 16 is made of aluminum, although other embodiments include plates made from copper, steel, iron or other thermally conductive material, including, but not limited to, another metallic, plastic or ceramic. The heated guide plate 16 can be mounted inside the convection chamber 4 and combined with the vacuum chamber 3 using, for example, an optional O 5 sealing ring. Air inside a vacuum chamber 3 is evacuated through the evacuation orifice 7 and vented through the ventilation orifice 6. The convection chamber 4, if used, may include a fan 9 for circulating hot air within the convection chamber 4.
    [00036] [00036] Figure 2 represents the heated conduction plate 16 with a heat generator (for example, a thermocouple resistance heater 21). The heated conduction plate 16 may also include a temperature feedback sensor 8, thermofilter resistance heater power connections 10, the evacuation orifice 7, and / or the ventilation orifice 6. In an embodiment of the invention, the heated conduit plate 16 is a separate stand-alone heating plate resting on a vacuum chamber mounting plate.
    [00037] [00037] Figure 3 represents the heated conduction plate 16 and the vacuum chamber 3 in a cut-out isometric view. The vacuum chamber 3 is coupled to the heated guide plate 16 using an O-ring
    [00038] [00038] Figures 4A and 4B represent vacuum chamber 3 in open state 17 and in closed state 18. The O-ring seal 5 joins with the vacuum chamber sealing surface 31 when transitioning from open state 17 to the closed state 18. During the closed state 18, the evacuation orifice 7 and atmospheric ventilation orifice 6 are sealed within the vacuum chamber 3 because they are arranged within the diameter of the O-ring seal 5.
    [00039] [00039] With reference to Figure 5, the box 1 of the electronic device drying apparatus is shown in an isometric view with a control diagram in the form of a block diagram, according to an embodiment of the present invention. A controller, for example, a microprocessor 44, is electrically connected to user interface 47, memory 45, Internet modem interface circuit 46, and evacuation pump relay 42 via user interface bus bars 48, bus bars user interface collectors 49, Internet modem interface collector bars 51 and evacuation pump relay control line 66, respectively. The power supply 53 energizes the entire system through, for example, the positive power line 58 and the negative ground line 55. The thermoblade resistance heater power lines 10 are directly connected to the positive power line 58 and the negative power line 55 through the heating plate control transistor 54. The evacuation manifold 62 is connected to the evacuation pump 41, which is electrically controlled via the evacuation pump control line 68. The vacuum pressure sensor 43 is connected to the evacuation manifold 62 and produces vacuum pressure level signals via the vacuum pressure sensor signal wire 52. A relative humidity sensor 61 can be pneumatically connected to the evacuation manifold 62 and can produce analog voltages that refer to the relative humidity of the evacuation manifold 62. Analog voltage signals are detected by the relative humidity signal wire 61 for the coprocessor microprocessor ntrol 44. The convection chamber ventilation solenoid 57 is connected to the convection chamber ventilation collector 64 and is controlled by the control microprocessor 44 via the convection chamber solenoid ventilation valve control signal 56. To the valve atmospheric ventilation solenoid 67 is connected to atmospheric ventilation manifold 75 and is controlled by control microprocessor 44 through atmospheric solenoid ventilation valve control signal wire 69.
    [00040] [00040] With reference to Figures 6A-6C, a graphical representation of the water vapor pressure curve 74 is derived from known vapor pressure conversions that refer to the water temperature 72 and the vacuum pressure of the air surrounding the water 70. Using the example shown in Figure 6B, water kept at temperature 81 (approximately 40 degrees C (104 degrees F)) will start to boil at vacuum pressure 83 (approximately -27 Hg). Using the vapor pressure curve 74, a target or preferred drying and heating zone 76 for automatic drying of portable electronic devices was determined. The upper temperature limit of the drying and evacuation zone 76 can be governed by the temperature at which the materials used to build the electronic device being dried will begin to deform or melt. The lower temperature limit of the drying and evacuation zone 76 can be governed by the ability of the evacuation pump 41 to generate low pressure or the amount of time required by the evacuation pump 41 to reach low pressure.
    [00041] [00041] With reference to Figure 7, a graphical representation of the heating curve of the heated conduction plate 80 that is being heated to a temperature value on the temperature axis 85 over some time represented on the time axis 87, according to a embodiment of the present invention. A portable electronic device resting on the heated conduction plate 16 is subject to the heating conduction plate heating curve 80 and generally heats up according to the device heating curve 82. The device heating curve 82 is represented with delay over time due to the variation in thermal conduction coefficients.
    [00042] [00042] With reference now to Figure 8, a graphical representation of the heating curve of the heated guide plate 80 is shown with the temperature axis 85 over time on the time axis 87 together with the vacuum pressure axis 92, of according to another embodiment of the present invention. As a result of the change in the vacuum pressure curve 98 and because of the latent heat that escapes due to vapor evaporation from the wet portable electronic device, the device heating curve 96 is produced.
    [00043] [00043] When the wetting inside the device evaporates, the device would typically cool down due to the latent heat of evaporation. Adding heat to the process minimizes device cooling and helps improve the rate at which moisture can be removed from the device.
    [00044] [00044] With reference to Figure 9, a graphical representation of the relative humidity sensor 61 is represented with the relative humidity axis 102 plotted against the cycle time axis 87, according to an embodiment of the present invention. As the wetting vaporizes on the portable electronic device, the vaporization produces a relative humidity curve 100 that becomes progressively smaller and follows the reduction line106. The peaks of relative humidity 104 become successively lower and eventually minimize to ambient humidity 108.
    [00045] [00045] In one embodiment, the electronic device drying apparatus 1 operates as follows:
    [00046] [00046] To start a drying cycle operation, the user then presses or activates the on-off switch 19, in order to turn on the drying device 1. Once when device 1 is energized, the user selects, through the switches input device selection (see Figures 1 and 5), the appropriate electronic device to be dried. Control microprocessor 44 detects user link selection via user interface pickup bars 48 by interrogating input device selection switches 11, and subsequently confirms user selection by lighting the appropriate device selection indicator lamp input 15 (Figure 1) for proper selection. The microprocessor 44 houses software in the non-volatile memory 45 and communicates with the software code through the user interface bus bars
    [00047] [00047] In an embodiment of the invention, memory 45 contains algorithms for the various portable electronic devices that can be dried by this invention - each algorithm containing specific temperature settings of the heated driving plate 16 - and the correct algorithm is automatically selected for the type of electronic device inserted in the device 1.
    [00048] [00048] In one embodiment, the microprocessor 44 activates or energizes the heated conductor plate 16 through the control transistor 54 which switches the positive and negative supply lines 58 and 55 of the power supply 53, respectively, to the power wires from heater 10. This switching of energy causes the thermocouple resistance heater 21 to generate heat through resistance heating. The thermocouple resistance heater 21, which is in thermal contact with (and can be laminated with) the heated guide plate 16, begins to heat up to the target temperature and through, for example, physical contact with the object device, allows heat to flow to and from the device via thermal conduction. In certain embodiments, the target temperature for the heated plate is at least 21.1 degrees C (70 degrees F) and a maximum of 65.5 degrees C (150 degrees F). In other embodiments, the target temperature for the heated plate is at least approximately 43.33 degrees C (110 degrees F) and at most approximately 48.89 degrees C (120 degrees F).
    [00049] [00049] In alternative modes, the heating of the heated driving plate 16 is carried out in alternative ways, such as by heating hot water, infrared lamps, incandescent lamps, flammable gas or fuel flame, Fresnel lenses, steam, human body heat, hair dryers, fissile materials, or heat produced from friction. Either of these heating methods would produce the heat necessary for the heated conductor plate 16 to transfer heat to a portable electronic device.
    [00050] [00050] During operation, microprocessor 44 interrogates the heated plate temperature sensor 8 (via the heated plate temperature sensor signal line 26) and supplies power to plate 16 until plate 16 reaches the target temperature. Once the target temperature is reached, the microprocessor 44 starts a timer, based on variables in memory 45 through the user interface collector bars 49, which allows sufficient time for the heated driving plate 16 to transfer heat to the portable electronic device. In some embodiments, the plate 16 has a heated conduction plate heating profile 80 takes a finite time to reach a target temperature. The heating profile 80 (Figure 7) is just one such algorithm, and the target temperature can be located anywhere on the temperature axis 85. As a result of the heated conduction plate 16 transferring heat into the object device, the profile of object temperature 82 is generated. In general, the temperature profile of the handheld electronic device 82 follows a heated conduit heating profile 80, and can generally fall anywhere on the temperature axis 85. Without further action, a heated conduction heating plate profile 80 and the heating profile of the portable electronic device 82 would reach a quiescent point and maintain these temperatures for a finite time over time 87. If the power was disconnected for the device 1, the heating profile of the heated driving plate 80 and the heating profile of the portable electronic device 85 would be cooled by each profile 84.
    [00051] [00051] During the heating cycle, the vacuum chamber 3 can be in open position 17 or closed position 18, as shown in Figures 4A and 4B. Any position has little effect on the conductive heat transfer from the heated guide plate 16 to the portable electronic device.
    [00052] [00052] The convection chamber fan 9 can be energized (via the fan control signal line 24 electrically connected to the microprocessor 44) to circulate the air inside the convection chamber 4 and outside the vacuum chamber 3. The air inside the convection chamber 4 is heated, at least in part, by radiated heat from the heated conduction plate 16. The convection chamber fan 9 provides a means of circulating air within the convection chamber 4 and helps to maintain a relatively uniform temperature of the heated air, inside a convection chamber 4, and surrounding a vacuum chamber 3. The microprocessor 44 can close the atmospheric ventilation solenoid valve 67 by sending an electrical signal through a signal line. control of atmospheric ventilation solenoid valve 69.
    [00053] [00053] In an embodiment of the invention, there are separate heating elements to control the heat inside the convection chamber 4. These heating elements can be common heaters by electrical resistance. In one embodiment, plate 16 can be used to heat convection chamber 4 without the need for a separate convection chamber heater.
    [00054] [00054] In operation, the microprocessor 44 signals to the user, as through the audible indicator 20 (Figures 1 and 5) that the heated driving plate 4 has reached the target temperature and can start an audible signal on the audible indicator 20 for the user moves vacuum chamber 3 from open position 17 to closed position 18 (see Figures 4A and 4B) in order to start the drying cycle. The start-stop switch 13 can then be compressed or activated by the user, after which the microprocessor 44 detects this action by interrogating the user interface bus bars 48 and sends a signal to the convection ventilation solenoid valve 57 ( through the control signal wire of the connection chamber ventilation solenoid 56), which then closes the atmospheric vent 6 through the pneumatically connected atmospheric ventilation manifold 64. The closing of the convection ventilation solenoid valve chamber 57 ensures that the vacuum chamber 3 is sealed when the evacuation of its internal air begins.
    [00055] [00055] After the electronic device has warmed up to a target temperature (or, in alternative modes, when the heated plate reaches a target temperature) and after an optional time delay, the pressure inside the vacuum chamber is reduced. In at least one embodiment, microprocessor 44 sends a control signal to motor relay 42 (via motor relay control signal line 66) to activate evacuation pump 41. Motor relay 42 energizes the evacuation pump 41 via the evacuation pump 68 power line. Upon activation, the evacuation pump 41 begins to evacuate air from inside the vacuum chamber 3 through the evacuation hole 7, which is pneumatically connected to the evacuation collector 62. The microprocessor 44 can display the elapsed time in the display timer14 (Figure 1). As the evacuation proceeds within vacuum chamber 3, the vacuum chamber sealing surface 31 compresses the O-ring of the vacuum chamber 5 against the surface of the heated conduit plate 16 to provide a vacuum impermeable seal. . The evacuation manifold 62 is pneumatically connected to the vacuum pressure sensor 43, which directs analog vacuum pressure signals to the microprocessor 44 via the vacuum pressure signal line 52 for monitoring and control purposes according to the appropriate algorithm for the particular electronic device being processed.
    [00056] [00056] When the air is being evacuated, the microprocessor 44 interrogates the temperature of the heated conduction plate 16, the vacuum chamber evacuation pressure sensor 43, and relative humidity sensor 61, through the temperature signal line 26 , the vacuum pressure signal line 52, and the relative humidity signal line 65, respectively. During this evacuation process, the vapor pressure point of, for example, water present on the surface of the components within the portable electronic device follows the known vapor pressure curve 74, as shown in Figures 6A-6C. In some embodiments, the microprocessor algorithms 44 have the target temperature and vacuum pressure variables that fall within, for example, a preferred vacuum drying target zone 76. The vacuum drying target zone 76 provides for water evaporation at lower temperatures based on the reduced pressure inside chamber 4. Microprocessor 44 can monitor pressure
    [00057] [00057] As the pressure inside the chamber decreases, the temperature of the electronic device will typically drop, at least in part due to the escape of latent heat from evaporation and the steam being renewed through the evacuation manifold 62, despite the plate heated (or whatever type of component is being used to apply heat) be kept at a constant temperature. The drop in pressure will also cause the relative humidity to increase, which will be detected by the relative humidity sensor 61 being pneumatically connected to the evacuation manifold 62.
    [00058] [00058] After the pressure inside the chamber has been reduced, it is increased again. This can occur after a predetermined amount of time or after a particular state (such as the relative humidity reached or approaching a steady state value) is detected. The increase in pressure can be performed by the microprocessor 44 sending a signal to the chamber of the convection ventilation solenoid valve 57 and of the atmospheric ventilation solenoid valve 67 (via the chamber ventilation solenoid valve control signal 56 and the control signal). atmospheric solenoid valve control 69) to open. This causes air, which may be ambient air, to enter the atmospheric control solenoid valve 67, and thus ventilate the convection chamber 4. The opening of the convection ventilation solenoid valve 57, which can occur simultaneously with the opening of the valve convection chamber ventilation solenoid 57 and / or atmospheric ventilation solenoid valve 67, allows heated air inside convection chamber 4 to be drawn into vacuum chamber 3 by vacuum pump 41. Atmospheric air (eg , ambient air) is drawn in due to the fact that the evacuation pump 41 remains on and drawing atmospheric air into the vacuum chamber 3 through the atmospheric ventilation manifold 64 and the evacuation manifold 62.
    [00059] [00059] After the relative humidity has been reduced (as optionally detected via relative humidity sensor 61 and a relative humidity sensor feedback signal sent through the relative humidity sensor feedback line 65 to microprocessor 44), the convection chamber ventilation solenoid valve 57 and the atmospheric solenoid valve 67 can be closed, such as via the convection chamber ventilation solenoid valve control signal 56 and the atmospheric solenoid valve control signal 69, and the pressure inside the vacuum chamber is reduced again.
    [00060] [00060] This sequence can produce an evacuation chamber profile curve 98 (Figures 8B and 8C), which can be repeated based on the selected algorithm and controlled under the control of microprocessor software 44. Repetitive vacuum cycling (which can conducted under constant heating) causes the humidifying agent to be evaporated and forced to change from a liquid to a gaseous state. This gaseous state of water allows the resulting water vapor to escape through the tortuous paths of the electronic device, through which liquid water cannot escape otherwise.
    [00061] [00061] In at least one embodiment, microprocessor 44 detects relative humidity peaks 104 (represented in Figure 9), such as through the use of a software algorithm that determines the peaks by detecting a decrease or absence of rate at which the relative humidity is changing. When a peak relative humidity 104 is detected, the pressure inside the vacuum chamber will be increased (such as by venting the vacuum chamber), and the relative humidity will decrease. Once when the relative humidity reaches a minimum relative humidity 108
    [00062] [00062] Referring to Figures 8A and 8C, the 96A response curve directional trace arrow generally results from heat gain when the system is in a purge air recovery mode, which allows the electronic device to gain heat. The 96B response curve directional trace arrow usually results from latent heat of evaporation when the system is in vacuum drying mode. When consecutive cycles are conducted, the temperature 96 of the electronic device will tend to increase gradually, and changes in temperature between successive cycles will tend to decrease.
    [00063] [00063] In some embodiments, the microprocessor 44 continues this repetitive cyclic heating and evacuation of the vacuum chamber 3, producing the relative humidity response curve 100 (Figure 9). This relative humidity response curve 100 can be monitored by the software algorithm with cyclic maximums of relative humidity 104 and cyclic minimums 108, stored in records within microprocessor 44. In alternative modalities, the maximum 104 and minimum 108 of relative humidity will typically follow the relative drying profiles of wetting 106A and 106B and are asymptotically minimized over time to minimums 109 and 110. Through one or more successive heating cycles 96 and evacuation cycles 98, as illustrated in Figure 8, the portable electronic device , arranged inside the vacuum chamber 3, is dried. The control algorithms inside the microprocessor 44 can determine when the difference between the maximum relative humidity 104 and the minimum relative humidity 108 is within a specified tolerance to guarantee the shutdown or shutdown of the vacuum pump 41.
    [00064] [00064] The system can automatically stop the execution of consecutive drying cycles when one or more criteria are met. For example, the system may stop running consecutive drying cycles when a parameter that changes when the device is dried approaches, or reaches, a steady state value or final value. In an example embodiment, the system automatically stops consecutive drying cycles when the relative humidity drops below a certain level or approaches (or reaches) a steady state value. In another example, the system automatically stops consecutive drying cycles when the difference between maximum and minimum relative humidity in a cycle falls below a certain level. In yet another example embodiment, the system automatically stops consecutive drying cycles when the temperature 96 of the electronic device approaches, or reaches, a steady state value.
    [00065] [00065] Referring again to Figures 1 and 5, microprocessor 44 can be remotely connected to the Internet via, for example, an RJ 11 12 internet modem connector, which is integrated into modem interface 46. Microprocessor 44 can thus sending an Internet or telephone signal via the Internet modem interface 46 and the RJ 11 12 Internet connector to signal to the user that the processing cycle has been completed and the electronic device sufficiently dried.
    [00066] [00066] Thus, simultaneous conductive heating and vacuum drying can be obtained and configured for specific electronic devices based on portable electronic construction materials in order to dry, without damage, the various types of electronic devices that are currently on the market. Marketplace.
    [00067] [00067] In alternative modes, an optional desiccator 63 (Figure 5) can be connected to the evacuation manifold 62 upstream of the evacuation pump 41. An example location for the desiccator 63 is downstream of the relative humidity sensor 61 and the amount of the evacuation pump 41. When included, the desiccator 63 can absorb the moisture in the air that comes from the vacuum chamber 3 before the humidification reaches the evacuation pump 41. In some embodiments, the desiccator 63 can be a desiccator replaceable or regenerative cartridge type.
    [00068] [00068] In modalities, in which the evacuation pump is of the type that uses oil, there may be a tendency for oil in an evacuation pump to renew (or absorb) water from the air, which can lead to the entry of water in the evacuation pump, premature depletion of oil in the evacuation pump, and / or premature failure of the evacuation pump itself. In modes in which the evacuation pump is an oil-free type, high humidity conditions can also lead to premature pump failure. As such, advantages can be realized by removing water (or possibly other constituents from the air) from the air with desiccator 63 before the air reaches the evacuation pump 41.
    [00069] [00069] While many of the above modalities describe drying apparatus and methods that are automatically controlled, other modalities include drying apparatus and methods that are manually controlled. For example, in one embodiment, a user controls the application of heat from the wet device, the application of a vacuum to the wet device, and the release of the vacuum to the wet device.
    [00070] [00070] Represented in Figure 10 is a drying apparatus, for example, an automatic portable drying apparatus of electronic device 200, according to another embodiment of the present invention. Many characteristics and components of the drying apparatus 200 are similar to the characteristics and components of the drying apparatus 1, with the same reference numbers being used to indicate characteristics and components that are similar between the two modalities. The drying apparatus 200 includes a disinfecting element, such as an ultraviolet (UV) germicidal lamp 202, which can, for example, kill germs. The lamp 202 can be mounted inside the convection chamber 4 and controlled by a UV germicidal lamp control signal 204. In one embodiment, the UV germicidal lamp 202 is mounted inside the convection chamber 4 and outside the vacuum chamber 3, with UV radiation being emitted by the germicidal lamp 202 and passing through the vacuum chamber 3, which can be manufactured from UV light transmissive material (an example being Acrylic plastic). In an alternative embodiment, the UV 202 germicidal lamp is mounted inside the vacuum chamber 3, which can have benefits in the modalities in which the vacuum chamber 3 is manufactured from non-transmissible material from UV light.
    [00071] [00071] In one embodiment, the operation of the drying apparatus 200 is similar to the operation of the drying apparatus 1 as described above with the following changes and clarifications. Microprocessor 44 sends the control signal through the germicidal lamp control line at UV 204 and energizes the germicidal lamp at UV 202, which can occur at, or close to, activation of the heated conduction plate 16 by microprocessor 44. In a mode, the UV 202 germicidal lamp will then emit UV waves of approximately a wavelength of 254 nm, which can penetrate the vacuum chamber 3, particularly in the modalities in which the vacuum chamber 3 is manufactured from clear plastic, in one mode.
    [00072] [00072] In still other embodiments, one or more desiccators 218 can be isolated from the drain manifold 62, which can have advantages when carrying out periodic maintenance or performing automated maintenance cycles of the drying apparatus. As an example, the embodiment shown in Figures 11-13 includes valves (for example, 3-way air vent solenoid valves 210 and 212) that can selectively connect and disconnect desiccator 218 from the evacuation manifold 62. The valve solenoid 210 is positioned between the relative humidity sensor 61 and the desiccator 218, and the solenoid valve 212 positioned between the desiccator 218 and the vacuum sensor 43. In the illustrated embodiment, the 3-way air purge valves 210 and 212 have its common distribution holes pneumatically connected to desiccator 218. This common orifice connection provides simultaneous isolation of desiccator 218 from exhaust manifold 62 and disconnection of exhaust manifold 62 and vacuum pump 41. This disconnection prevents the humidification from vacuum chamber 3 reaches vacuum pump 41, while desiccator 63 is being regenerated. The operation of this modality is similar to the modality described in relation to Figure 5, with the following changes and clarifications.
    [00073] [00073] An optional desiccator heater 220 and optional desiccant air purge pump 224 can be included. While desiccator 218 is isolated from the evacuation manifold 62 and vacuum pump 41, desiccator 218 can be heated by desiccator heater 220 without affecting vacuum manifold 62 and associated pneumatic vacuum circuit. When desiccant inside desiccator 218 is heated, for example, to a target temperature, to extract the absorbed moisture by heating, the purge pump 224 can be modulated (for example, according to a maintenance control algorithm with a prescribed time and / or temperature profile controlled by microprocessor 44) to assist in the removal of wetting from desiccant 218. In certain embodiments, the target temperature for the desiccator heater is at least 93.33 degrees C (200 degrees F) and at most 148.89 degrees C (300 degrees F). In other embodiments, the target temperature for the desiccator heater is approximately 121.11 degrees C (250 degrees F).
    [00074] [00074] When the purge pump 224 is modulated, atmospheric air is forced along the air path 235, through the dehydrator housed inside the desiccator 218, and the humidified air is blown out through the atmospheric orifice 238. An optional desiccator cooling fan 222 can be included (and optionally modulated by microprocessor 44) to reduce the temperature of the desiccant within desiccator 218 to a temperature appropriate for the desiccant to absorb moisture, rather than the humidification of the outlet gas.
    [00075] [00075] When the drying cycle is started, according to a modality, the atmospheric sigh 6 is closed and the microprocessor 44 sends the control signals through the 3-way air purge solenoid control line 214 to the valves 3-way bleed solenoids 210 and 212. This operation closes the 3-way bleed solenoid valves 210 and 212 and allows the vacuum pump 41 to connect pneumatically to the evacuation manifold 62. This pneumatic connection allows evacuated air flows along directional air path 215, through evacuation manifold 62 and through desiccator 218 before reaching vacuum pump 41. An advantage that can be achieved by removing humidification from evacuated air before reaching to the vacuum pump 41 is a dramatic decrease in the failure rate of the vacuum pump 41.
    [00076] [00076] After the microprocessor algorithm 44 detects that the portable electronic device is dry, the microprocessor 44 can signal the system to enter and a maintenance mode. The UV germicidal lamp 202 can be de-energized via the UV 204 germicidal lamp control line from microprocessor 44. Microprocessor 44 energizes desiccator heater 220 via desiccator heater energy relay control signal 166 and the desiccator heater power relay 228. Control signal 226 is the control signal for relay 228. Desiccator temperature 218 can be sampled by microprocessor 44 through desiccator temperature probe 230, and desiccator heating 218 can be controlled to a specific temperature that begins to heat up the humidification in the desiccant housed in the desiccator 218. The 3-way air vent solenoid valves 210 and 212 can be electrically switched via the air vent solenoid control line. 3-way 202, when it is determined that sufficient drying has occurred, which can occur in a finite time specified by the processor maintenance algorithm 44. The air purge pump 224 can then be connected by microprocessor 44 via the air purge pump control signal 232 to drain the humidified air through desiccator 218 and into the atmospheric ventilation hole 238. O microprocessor 44 can use a timer in the maintenance algorithm to heat and purge the charged air with humidification for a finite time. Once when the optional maintenance cycle is complete, microprocessor 44 can turn on the desiccant cooling fan 222 to cool the desiccator
    [00077] [00077] With reference to Figure 12, desiccator 218 is shown with a desiccator heater 220, a desiccant temperature sensor 230, a desiccant cooling fan 222, and desiccant air purge solenoid valves 210 and 212 The vacuum pump 41 is connected to the evacuation manifold 62 and the air purge pump 224 is pneumatically connected to the air vent solenoid valve 212 through the air vent collector 240. The air vent solenoid valves three routes 210 and 212 are represented in the state to allow vacuum through desiccator 218, as shown by the directional air path.
    [00078] [00078] With reference to Figure 13, the desiccant 3-way air vent solenoid valves 210 and 212 are represented in a maintenance state, which allows air flow from the air vent pump 224 to drain “backwards ”Along direction 235 through the desiccator and out through the vent air hole 238. The air vent pump 224 can cause pressurized air to flow along directional air path 235. This preferred directional path of atmospheric air allows the desiccant to humidify in a pneumatically isolated state and prevents humidification from entering the air purge pump 224, which would occur if the air purge pump had to draw air through the desiccator 218. The purge pump 224 can continue blowing air in directional path 235 a time prescribed in the microprocessor maintenance control algorithm 44. In one embodiment, an in-line relative humidity sensor, similar to relative humidity sensor 61, is incorporated to detect when the desiccator 218 is sufficiently dry.
    [00079] [00079] As described above in at least one embodiment, the evacuation manifold 62 is disconnected from the vacuum pump 41 when the desiccator 218 is disconnected from the evacuation manifold 62. However, alternative modalities include an evacuation manifold 62 which remains pneumatically connected with the vacuum pump 41 when the desiccator 218 is disconnected from the evacuation manifold 62. This configuration can be useful in situations where the desiccator 218 may be blocking the air flow, such as when the desiccator 218 has malfunctioned, and the operation of the drying apparatus 200 is still desired.
    [00080] [00080] In some modalities, all of the actions described above are performed automatically, so that a user can simply place an electronic device in the appropriate place and activate the drying device so that the drying device removes the wetting of the electronic device.
    [00081] [00081] Microprocessor 44 can be a microcontroller, general purpose microprocessor, or generally any type of controller that can perform the required control functions. Microprocessor 44 can read its program from memory 45, and can be composed of one or more components configured as a single unit. Alternatively, in a multi-component form, processor 44 may have one or more components positioned remotely in relation to the others. One or more components of processor 44 may be of the electronic variety, including digital circuits, analog circuits, or both. In one embodiment, processor 44 is a conventional, integrated circuit microprocessor array, such as one or more INTEL Corporation CORE 17 HEXA processors (450 Mission College Boulevard, Santa Clara, California 95052, USA), ATHLON or PHENOM processors from Advanced Micro Devices (One AMD Place, Sunnyvale, California 94088, USA), POWER8 processors from IBM Corporation (1 New Orchard Road; Armonk, New York 10504, USA), or PIC microcontrollers from Microchip Technologies (2355 West Chandler Boulevard, Chandler , Arizona 85224, USA). In alternative modalities, one or more application specific integrated circuits (ASICSs), reduced instruction set computing (RISK) processors, general purpose microprocessors, programmable logic arrangements, or other devices can be used alone or in combination, as will occur for those specialized in the technique.
    [00082] [00082] Likewise, memory 45, in various modalities, includes one or more types, such as solid-state electronic memory, magnetic memory, or optical memory, just to name a few. As a non-limiting example, memory 45 may include electronic solid-state Random Access Memory (RAM), Sequentially Accessible Memory (SAM) (such as the variety of First Inputs, First Outputs (FIFO) or the variety of Latest Entries First Outputs (LIFO), Programmable Read-Only Memory (PROM), Electrically Programmable Read-Only Memory (EPROM), or Programmable Read-Only, Electrically Erasable Memory,
    [00083] [00083] Still other modalities include the characteristics described in any of the previous instructions XI, X2, X3, X4, X5, X6, and X7, when combined with one or more of the following aspects:
    [00084] [00084] A germicidal UV lamp device for disinfecting portable electronic devices.
    [00085] [00085] In which said heated conduit plate is made up of a laminated thermocouple heater on the metallic conduction plate.
    [00086] [00086] In which the said thermostat heater of the heated driving plate is between 25 Watts and 1000 Watts.
    [00087] [00087] In which said heated driving plate uses a temperature feedback sensor.
    [00088] [00088] Where said surface area of the heated driving plate is between 4 square inches and 1500 square inches.
    [00089] [00089] wherein said heated conduction plate is also used as a convection oven heater to heat the exterior of a vacuum chamber.
    [00090] [00090] In which said convection oven is used to heat the exterior of a vacuum chamber to minimize condensation from the internal vacuum chamber, once vaporization occurs.
    [00091] [00091] In which said vacuum chamber is manufactured from a material suitable for vacuum, such as plastic, metal, or glass.
    [00092] [00092] In which said vacuum chamber is constructed in such a way as to withstand vacuum pressures up to 30 inches of mercury below atmospheric pressure.
    [00093] [00093] In which the said volume of the vacuum chamber is between 0.25 liters and 12 liters.
    [00094] [00094] In which the said evacuation pump has a minimum vacuum pressure of 19 inches of mercury below atmospheric pressure.
    [00095] [00095] In which said solenoid valves have an orifice diameter between 0.025 inches and 1,000 inches.
    [00096] [00096] In which said solenoid valve is used to provide a path for atmospheric air to exchange heated air in the oven by convection.
    [00097] [00097] Where the microprocessor controller uses algorithms stored in memory for controlled vacuum drying.
    [00098] [00098] In which said relative humidity sensor is pneumatically connected to the vacuum chamber and used to sample relative humidity in real time.
    [00099] [00099] Where the microprocessor controller uses the maximum and minimum relative humidity for controlled vacuum drying.
    [000100] [000100] In which the microprocessor controller automatically controls the heated conduction temperature, vacuum pressure, and cycle times.
    [000101] [000101] Where the microprocessor controller uses a pressure sensor, temperature sensor, and relative humidity sensor as feedback for the heated vacuum drying.
    [000102] [000102] Where the microprocessor controller records performance data and can transmit over an Internet modem interface.
    [000103] [000103] In which the said arrangement of switches for the selection of algorithm provides a simple control method.
    [000104] [000104] In which said regenerative desiccator is heated by external thermo-blade heaters between 25 W and 1000 W.
    [000105] [000105] In which the said regenerative desiccator uses a fan and temperature signal to allow precise control of the closed link temperature to cook the dehydrator.
    [000106] [000106] In which said regenerative desiccator uses pneumatic 3-way valves to pneumatically isolate and switch the direction of air flow and path to purge said desiccator.
    [000107] [000107] In which the said germicidal UV lamp emits UV radiation at a wavelength of 254 nm and a power range between 1 W and 250 W to provide adequate UV radiation to disinfect portable electronic devices.
    [000108] [000108] In which the said UV germicidal lamp disinfects portable electronic devices from between 1 minute and 480 minutes.
    [000109] [000109] In which said regenerative desiccator is heated from 48.89 degrees C (120 degrees F) to 260 degrees C (500 degrees F) to provide a drying medium.
    [000110] [000110] In which said regenerative desiccator is heated between 5 minutes and 600 minutes to provide ample drying time.
    [000111] [000111] In which the heated heated plate is heated between 70 degrees F and 93.33 degrees C (200 degrees F) to reintroduce heat as compensation for the loss due to the latent heat of evaporative loss.
    [000112] [000112] Where the microprocessor controller records performance data and can transmit and receive performance data and software updates wirelessly over a wireless cellular network.
    [000113] [000113] Where the microprocessor controller records performance data and can print results on a wireless printer via Internet Protocol or a locally installed printer. [0001 14] Where said placement includes placing the portable electronic device on a plate, and said heating includes heating the plate to at least approximately 43.33 degrees C (110 degrees F) and at most approximately 48.89 degrees C (120 degrees PF).
    [000115] [000115] Where said pressure decrease includes decreasing the pressure to at least approximately 0.94 atm (28 inches Hg) below the pressure outside the chamber.
    [000116] [000116] Where said pressure decrease includes decreasing the pressure to at least approximately 1.002 atm (30 inches of Hg) below the pressure outside the chamber.
    [000117] [000117] Where said placement includes placing the portable electronic device on a plate, said heating includes heating the plate to at least approximately 43.33 degrees C (110 degrees F) and at most approximately 48.89 degrees C (120 degrees FP), and said pressure drop includes decreasing the pressure to at least approximately 0.94 atm (28 inches Hg) below the pressure outside the chamber.
    [000118] [000118] In which said pressure decrease and pressure increase are repeated sequentially before said removal of the portable electronic device.
    [000119] [000119] Automatically control said pressure decrease and pressure increase repeated according to at least one predetermined criterion.
    [000120] [000120] Detect when a sufficient amount of wetting has been removed from the electronic device.
    [000121] [000121] Stop the pressure decrease and the pressure increase repeated.
    [000122] [000122] Measure the relative humidity inside the chamber.
    [000123] [000123] Increase the pressure in the chamber after the relative humidity has been reduced and the rate of decrease in the relative humidity has become slow.
    [000124] [000124] In which said pressure decrease and pressure increase are repeated sequentially before said removal of the portable electronic device.
    [000125] [000125] Where the said pressure decrease begins when the relative humidity has increased and the rate of increase in the relative humidity has become slow.
    [000126] [000126] Where the said pressure decrease and repeated pressure increase are stopped once when the difference between a maximum relative humidity and a minimum relative humidity is within a predetermined tolerance.
    [000127] [000127] In which the said pressure decrease and repeated pressure increase are stopped once when the relative humidity inside the chamber reaches a predetermined value.
    [000128] [000128] Decrease pressure inside the low pressure chamber using a pump.
    [000129] [000129] Remove the wetting from the gas being pulled from the chamber with a pump before the gas reaches the pump.
    [000130] [000130] Where said removal of moisturizing includes removing moisturizing using a desiccant containing desiccant.
    [000131] [000131] Remove moisture from the dehydrator.
    [000132] [000132] Isolate the desiccant from the pump before said removal of moisture from the desiccant.
    [000133] [000133] Reverse the air flow through the desiccator while removing moisture from the desiccant.
    [000134] [000134] Heat the desiccant during said removal of humidification from the desiccant.
    [000135] [000135] Where said heating includes heating the dehydrator to at least 93.33 degrees C (200 degrees F) and at most 148.89 degrees C (300 degrees F).
    [000136] [000136] Where said heating includes heating the dehydrator to approximately 121.11 degrees C (250 degrees F).
    [000137] [000137] Where the controller controls the evacuation pump to decrease the pressure inside the low pressure chamber multiple times, and where the pressure inside the low pressure chamber increases between successive decreases in pressure.
    [000138] [000138] A humidity sensor connected to the low pressure chamber and the controller, in which the controller controls the evacuation pump to stop at least temporarily the pressure drop inside the low pressure chamber based at least in part on the received signals from the humidity sensor.
    [000139] [000139] Where the controller controls the evacuation pump to stop the pressure drop inside the low pressure chamber at least temporarily when the rate at which the relative humidity changes decreases or is approximately zero.
    [000140] [000140] Where the controller controls the evacuation pump to start the pressure drop inside the low pressure chamber when the rate at which the relative humidity changes decreases or is approximately zero.
    [000141] [000141] Where the humidity sensor detects maximum and minimum values of relative humidity when the evacuation pump decreases the pressure inside the low pressure chamber multiple times, and where the controller determines that the device is dry when the difference between successive maximum and minimum values of relative humidity is equal to or less than a predetermined value.
    [000142] [000142] A valve connected to the low pressure chamber and the controller, in which the pressure inside the low pressure chamber increases between successive decreases in pressure at least in part due to the controller controlling the valve to increase the pressure.
    [000143] [000143] Where the controller controls the valve to increase the pressure inside the low pressure chamber at approximately the same time as the controller controls the evacuation pump to stop the pressure drop inside the low pressure chamber.
    [000144] [000144] In which the controller controls the valve to equalize pressure between the interior of the low pressure chamber and the exterior of the low pressure chamber.
    [000145] [000145] A temperature sensor connected to the heater and the controller, in which the controller controls the heater to maintain a predetermined temperature based at least in part on signals received from a pressure sensor.
    [000146] [000146] A pressure sensor connected to the low pressure chamber and the controller, where the controller controls the evacuation pump to stop at least temporarily the pressure drop inside the low pressure chamber based at least in part on received signals from a pressure sensor.
    [000147] [000147] Where the heater includes a plate with which the electronic device is in direct contact during the removal of moisture from the electronic device.
    [000148] [000148] Disinfect the electronic device.
    [000149] [000149] A UV lamp to disinfect the electronic device.
    [000150] [000150] Although in the examples illustrated representative modalities and specific forms of the invention have been illustrated and described in detail in the drawings and preceding description, they should be considered as illustrative and not restrictive or limiting. The description of particular features in a modality does not imply that those particular features are necessarily limited to that modality. Characteristics of one modality can be used in combination with characteristics of other modalities, as would be understood by a person of ordinary skill in the art, whether or not explicitly described as such. Example modalities have been shown and described, and all changes and modifications that fall within the spirit of the invention are desired to be protected.
    权利要求:
    Claims (41)
    [1]
    1. Method for drying an electronic device, characterized by the fact that it comprises: placing a portable electronic device that has been rendered at least partially inoperative due to the intrusion of humidification into a low pressure chamber; heat the electronic device; decrease the pressure inside the low pressure chamber; removing moisture from the inside of the portable electronic device to the outside of the portable electronic device; increasing the pressure inside the low pressure chamber after said pressure decrease; equalize the pressure inside the low pressure chamber with the pressure outside the low pressure chamber; and removing the portable electronic device from the low pressure chamber.
    [2]
    2. Method according to claim 1, characterized in that said placement includes placing the portable electronic device in a press, and said heating includes heating the press to at least about 43.3 degrees C (110 degrees F ) and at most approximately 48.9 degrees C (120 degrees F).
    [3]
    Method according to claim 1, characterized in that said pressure decrease includes decreasing the pressure to at least about 71.2 cm (28 inches) of Hg below the pressure outside the chamber.
    [4]
    Method according to claim 1, characterized in that said pressure decrease includes decreasing the pressure to at least about 76.2 cm (30 inches) of Hg below the pressure outside the chamber.
    [5]
    5. Method according to claim 1, characterized in that said placement includes the placement of the portable electronic device of a press, said heating includes heating the cylinder to at least about 43.3 degrees C ( 110 degrees F) and at most about 48.9 degrees C (120 degrees FP), and said pressure drop includes lowering the pressure to at least about 71.2 cm (28 inches) of Hg below the pressure of the outside the chamber.
    [6]
    6. Method according to claim 1, characterized in that said decrease in pressure and increase in pressure are repeated sequentially before said removal of the portable electronic device.
    [7]
    7. Method according to claim 6, characterized by the fact that it comprises: automatically controlling said repeated pressure decrease and pressure increase according to at least one predetermined criterion.
    [8]
    8. Method according to claim 6, characterized by the fact that it comprises: detecting when a sufficient amount of wetting has been removed from the electronic device; and interrupting pressure decrease and pressure increase repeated after said detection.
    [9]
    9. Method according to claim 1, 2, 3, 4, 5, 6.7 or 8, characterized by the fact that it comprises: measuring the relative humidity inside the low pressure chamber; and increasing the pressure after the relative humidity has decreased and the rate of decrease in relative humidity has decreased.
    [10]
    10. Method according to claim 1, 2, 3, 4, 5, 6.7 or 8, characterized by the fact that it comprises:
    measure the relative humidity inside the low pressure chamber; wherein said pressure decrease and pressure increase are repeated sequentially before said removal of the portable electronic device; and wherein said decrease in pressure begins when the relative humidity of the air increases and the rate of increase in relative humidity decreases.
    [11]
    11. Method according to claim 1, 2,3,4,5,6,7 or 8, characterized by the fact that it comprises: measuring the relative humidity inside the low pressure chamber; wherein said pressure decrease and pressure increase are repeated sequentially before said removal of the portable electronic device; and in which said repeated pressure decrease and pressure increase are interrupted, since the difference between a maximum of sequential relative humidity and a minimum of relative humidity are within a predetermined tolerance.
    [12]
    12. Method according to claim 1, 2,3,4,5,6,7 or 8, characterized by the fact that it comprises: measuring the relative humidity inside the low pressure chamber; wherein said pressure decrease and pressure increase are repeated sequentially before said removal of the portable electronic device; and wherein said repeated decreases in pressure and increases in pressure are interrupted once the relative humidity inside the chamber reaches a predetermined value.
    [13]
    13. Method according to claim 1, 2, 3, 4, 5, 6,7 or 8, characterized in that it comprises: decreasing the pressure inside the low pressure chamber using a pump; and remove the wetting of the gas being removed from the chamber with the pump before the gas reaches the pump.
    [14]
    Method according to claim 13, characterized in that said removal of wetting includes removing wetting using a desiccant containing desiccant.
    [15]
    15. Method according to claim 14, characterized in that it comprises: removing moisture from the desiccant.
    [16]
    16. Method according to claim 15, characterized by the fact that it comprises: isolating the desiccant from the pump before said removal of the desiccant humidification.
    [17]
    17. Method according to claim 15, characterized in that it comprises: inverting the air flow through the desiccator, removing the desiccant's moisture.
    [18]
    18. Method according to claim 15, characterized by the fact that it comprises: heating the desiccant during said desiccant wetting removal.
    [19]
    19. Method according to claim 15, characterized in that said heating includes heating the desiccant to at least 93.3 degrees C (200 degrees F) and at most 148.9 degrees C (300 degrees F).
    [20]
    20. Method according to claim 15, characterized in that said heating includes heating the desiccant to about 121.1 degrees C (250 degrees F).
    [21]
    21. Method according to claim 1,2,3,4,5,6,7 or 8, characterized by the fact that it comprises: disinfecting the electronic device.
    [22]
    22. Method according to claim 21, characterized by the fact that said disinfectant includes irradiation of the electronic device with ultraviolet light.
    [23]
    Method according to claim 1, 2, 3.4, 5.6 or 7, characterized in that it comprises: detecting when a sufficient amount of wetting has been removed from the electronic device.
    [24]
    24. Apparatus for drying an electronic device, characterized by the fact that it comprises: a low pressure chamber defining an interior low pressure chamber having an interior dimensioned and configured for placing an electronic device inside and removing an electronic device from the inside ; an evacuation pump connected to the chamber; a heater connected to the chamber; and a controller connected to the evacuation pump and to the heater, the controller controlling the removal of moisture from the electronic device by controlling the evacuation pump to decrease the pressure inside the low pressure chamber and control the operation of the heater to add heat to the electronic device.
    [25]
    25. Apparatus according to claim 24, characterized in that the controller controls the evacuation pump to decrease the pressure inside the low pressure chamber several times, and in which the pressure inside the low pressure chamber increases between successive decreases in pressure.
    [26]
    26. Apparatus according to claim 24 or 25, characterized in that it comprises: a humidity sensor connected to the low pressure chamber and the controller, in which the controller controls the evacuation pump to interrupt at least temporarily the pressure decrease inside the low pressure chamber based, at least in part, on signals received from the humidity sensor.
    [27]
    27. Apparatus according to claim 26, characterized in that the controller controls the evacuation pump to at least temporarily stop the pressure drop inside the low pressure chamber when the rate at which the humidity changes, decreases or is approximately zero.
    [28]
    28. Apparatus according to claim 26, characterized by the fact that the humidity sensor detects the maximum and minimum values of relative humidity when the evacuation pump decreases the pressure inside the low pressure chamber several times, and in which the controller determines that the device is dry when the difference between the maximum and minimum relative humidity values is equal to or less than a predetermined value.
    [29]
    29. Apparatus according to claim 24 or 25, characterized in that it comprises: a humidity sensor connected to the low pressure chamber and the controller, in which the controller controls the evacuation pump begins to decrease the pressure inside the chamber low pressure when the rate at which the relative humidity changes, either decreases or is approximately zero.
    [30]
    30. Apparatus according to claim 25, 26, 27, 28 or 29, characterized in that it comprises: a valve connected to the low pressure chamber and the controller, in which the pressure inside the low pressure chamber increases between the successive decreases in pressure, at least in part, due to the controller controlling the valve to increase the pressure.
    [31]
    31. Apparatus according to claim 30, characterized in that the controller controls the valve to increase the pressure inside the low pressure chamber with approximately the same time as the controller controls the evacuation pump to stop the pressure drop inside the low pressure chamber.
    [32]
    32. Apparatus according to claim 29, characterized by the fact that the controller controls the valve to equalize the pressure between the interior of the low pressure chamber and the outside of the low pressure chamber.
    [33]
    33. Apparatus according to claim 24 or 25, characterized in that it comprises: a temperature sensor connected to the heater and the controller, in which the controller controls the heater to maintain a predetermined temperature based, at least in part, on signals received from the pressure sensor.
    [34]
    34. Apparatus according to claim 24 or 25, characterized in that it comprises: a pressure sensor connected to the low pressure chamber and the controller, in which the controller controls the evacuation pump to interrupt at least temporarily the pressure decrease in the low pressure chamber based, at least in part, on signals received from the pressure sensor.
    [35]
    35. Apparatus according to claim 24, characterized by the fact that the heater includes a cylinder with which the electronic device is in direct contact during the removal of moisture from the electronic device.
    [36]
    36. Apparatus according to claim 24, characterized by the fact that it comprises: a sterilization member connected to the chamber, the sterilization member being configured and adapted to exterminate germs in an electronic device positioned inside the chamber.
    [37]
    37. Apparatus according to claim 24, characterized by the fact that the sterilization member is an ultraviolet lamp.
    [38]
    38. Device for removing moisture from an electronic device, characterized by the fact that it is substantially as described herein with reference to the attached figures.
    [39]
    39. Method for removing moisture from an electronic device, characterized by the fact that it is substantially as described herein with reference to the attached figures.
    [40]
    40. Method for manufacturing a device, characterized in that it is substantially as described herein with reference to the accompanying figures.
    [41]
    41. Apparatus for drying an electronic device, characterized by the fact that it comprises: means for heating an electronic device; means for reducing the pressure inside the electronic device; and means for detecting when a sufficient amount of wetting has been removed from the electronic device.
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    法律状态:
    2020-11-10| B06F| Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]|
    2020-12-15| B06U| Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]|
    2021-08-03| B07A| Application suspended after technical examination (opinion) [chapter 7.1 patent gazette]|
    2021-12-07| B350| Update of information on the portal [chapter 15.35 patent gazette]|
    2021-12-14| B09A| Decision: intention to grant [chapter 9.1 patent gazette]|
    2022-03-03| B16A| Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]|Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 01/02/2013, OBSERVADAS AS CONDICOES LEGAIS. |
    优先权:
    申请号 | 申请日 | 专利标题
    US201261593617P| true| 2012-02-01|2012-02-01|
    US61/593617|2012-02-01|
    US201261638599P| true| 2012-04-26|2012-04-26|
    US61/638599|2012-04-26|
    PCT/US2013/024277|WO2013116599A1|2012-02-01|2013-02-01|Methods and apparatuses for drying electronic devices|
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